Ultrashort pulse laser cutting ensures ultra-high quality and precision on diverse materials – hard, fragile, soft, transparent, non-transparent, tempered, non-tempered, etc.
Here we are listing the most common applications – if you have needs for not listed materials cutting, do not hesitate to discuss it with our team.
Glass Cutting
Laser cutting (scribing) process is optimized for each type of glass (tempered and non-tempered). The processing window is wide and can be easily set up according to various parameters.
Features:
- Straight and round cut trajectories
- Thickness of tempered glass from 0,3 mm to 1,3 mm
- Thickness of non-tempered glass from 0,03 mm to 1 mm
- DOL of tempered glass from 10 μm to 80 μm (depends on glass thickness)
- Cutting speed from 200 mm/s
- Cut surface roughness Ra<1 μm
- Easy to break after processing
- Smooth edges: minimal or no post-processing needed
- No visible cracks or collateral damage near the cut line
- Different processing parameters might be developed upon request.
Thin films | Foils cutting
Laser cutting by cold ablation process is optimized for each material (plastic film, metal foil, others) that is used. Depending on customer needs we focus on minimal discoloration effects, cutting speed, or accuracy.
Features:
- Straight and round cut trajectories
- Minimal or no discoloration
- Minimal or no signs of heat-affected deformations
- Excellent cut surface quality, sub-micron precision of shape
- High speed laser processing
- Different processing parameters might be developed upon request.
Sapphire cutting
Laser cutting (scribing) process is optimized for each type of sapphire that is used.
The processing window is wide and can be easily set up according to various parameters.
Features:
- Straight and round cut trajectories
- The thickness of sapphire from 100 μm to 760 μm
- Cutting speed 200 mm/s or faster
- Cut surface roughness Ra<1μm
- Easy to break after processing
- Smooth edges: minimal or no post-processing needed
- No visible cracks or collateral damage near the cut line
- Different processing parameters might be developed upon request.